Bond

Description

 

Size: 15 ml

Bond – Acid-Free Nail Prep & Adhesion Promoter

Bond is an acid-free adhesion promoter designed to improve the bond between the natural nail plate and professional nail enhancement systems.

It is suitable under acrygel, builder gel, gel polish and acrylic systems.

Unlike air-drying prep liquids, Bond leaves a slightly tacky layer on the nail surface, so it should always be applied very thinly.

Key Features

• Acid-free adhesion promoter
• Helps improve product retention
• Suitable under acrygel
• Suitable under builder gel
• Suitable under gel polish
• Suitable under acrylic systems
• Leaves a tacky adhesion layer
• Designed for professional nail preparation
• Suitable for use on exposed natural nail during infills

Recommended Uses

• Acrygel services
• Builder gel services
• Gel polish services
• Acrylic systems
• New sets
• Infills

How to Use

Apply a very thin layer to the natural nail plate.

Allow the surface to remain slightly tacky before applying the next product.

During infills, apply Bond only to the exposed natural nail.

Important Information

Bond does not evaporate completely or leave a dry surface.

Its tacky layer is part of how it supports adhesion.

Avoid over-application, as too much product may reduce adhesion and contribute to lifting.

Who Is It For?

Ideal for nail professionals looking for an acid-free adhesion promoter for reliable, long-lasting salon services.

Ingredients

Ethyl Acetate, Isopropyl Alcohol, Isopropylidenediphenyl Bisoxyhydroxypropyl Methacrylate, Hydroxycyclohexyl Phenyl Ketone, HEMA, Diethylene Glykol Monomethylacrylate, Diethylene Glykol Monomethylacrylate